The science and engineering of microelectronic fabrication / Stephen A. Campbell.
Material type:
TextSeries: Oxford series in electrical and computer engineeringPublication details: New York : Oxford University Press, 2007, c2001.Edition: 2nd edDescription: xiv, 603 p. : ill. ; 25 cmISBN: - 9780198084808
- 621.38152 21 CAM
- TK7871.85 .C25 2001
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Includes bibliographical references and index.
Pt. I. Overview and Materials. Ch. 1. An Introduction to Microelectronic Fabrication. Ch. 2. Semiconductor Substrates -- Pt. II. Unit Process I: Hot Processing and Ion Implantation. Ch. 3. Diffusion. Ch. 4. Thermal Oxidation. Ch. 5. Ion Implantation. Ch. 6. Rapid Thermal Processing -- Pt. III. Unit Processes 2: Pattern Transfer. Ch. 7. Optical Lithography. Ch. 8. Photoresists. Ch. 9. Nonoptical Lithographic Techniques[superscript +]. Ch. 10. Vacuum Science and Plasmas. Ch. 11. Etching -- Pt. IV. Unit Processes 3: Thin Films. Ch. 12. Physical Deposition: Evaporation and Sputtering. Ch. 13. Chemical Vapor Deposition. Ch. 14. Epitaxial Growth -- Pt. V. Process Integration. Ch. 15. Device Isolation, Contacts, and Metallization. Ch. 16. CMOS Technologies. Ch. 17. GaAs Technologies. Ch. 18. Silicon Bipolar Technologies. Ch. 19. MEMS. Ch. 20. Integrated Circuit Manufacturing. App. II. Properties of Selected Semiconductor Materials --
App. III. Physical Constants -- App. IV. Conversion Factors -- App. V. Some Properties of the Error Function -- App. VI. F Values -- App. VII. SUPREM Commands.
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