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Nanopackaging : nanotechnologies and electronics packaging / edited by James E. Morris - New York ; London : Springer, 2008. - xxi, 543 p. : ill. 25 cm.

Nanopackaging: nanotechnologies and electronics packaging -- Modelling technologies and applications -- Application of molecular dynamics simulation -- Advances in delamination modeling -- Nanoparticle properties -- Nanoparticle fabrication -- Nanoparticle-based high- k dieelectric composites: opportunities and challenges -- Nanostructured resistor materials -- Nanogranular magnetic core inductors: design, fabrication and packaging -- Nanoconductive adhesives -- Nanoparticles in microvias -- Materials and technology for conductive microstructures -- A study of nanoparticles in SnAg-based lead-free solders -- Nano-underfills for fine-pitch electronics -- Carbon nanotubes: synthesis and characterization -- Characteristics of carbon nanotubes for nanoelectronic device applications -- Carbon nanotubes for thermal management of microsystems -- Electromagnetic shielding of transceiver packaging using multiwall carbon nanotubes -- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu solders reinforced with single-wall carbon nanotubes -- Nanowires in electronics packaging -- Design and development of stress-engineered compliant interconnect for microelectronic packaging -- Flip chip packaging for nanoscale silicon logic devices: challenges and opportunities -- Nanoelectronics landscape: application, technology and economy -- Ch.1. Ch.2. Ch.3. Ch.4. Ch.5. Ch.6. Ch.7. Ch.8. Ch.9. Ch.10. Ch.11. Ch.12. Ch.13. Ch.14. Ch.15. Ch.16. Ch.17. Ch.18. Ch.19. Ch.20. Ch.21. Ch.22. Ch.23.

"Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement." "Nanopackaging: Nanotechnologies and Electronics Packaging is an important reference for industrial and academic researchers as well as practicing engineers seeking information about the latest techniques."--BOOK JACKET.

ISBN: 9780387473253 (hbk.) 0387473254 (hbk.)

Nat. Bib. No.: GBA773746 bnb

Nat. Bib. Agency Control No.: 013889458 Uk

Subjects--Topical Terms:
Electronic packaging.
Nanotechnology.

Dewey Class. No.: 621.381046 / NAN