Nanopackaging : nanotechnologies and electronics packaging / edited by James E. Morris
Material type: TextPublication details: New York ; London : Springer, 2008.Description: xxi, 543 p. : ill. 25 cmISBN:- 9780387473253 (hbk.)
- 0387473254 (hbk.)
- 621.381046 22 NAN
Item type | Current library | Collection | Call number | Status | Date due | Barcode | Item holds |
---|---|---|---|---|---|---|---|
Reference | Learning Resource Centre | Reference Collection | 621.381046 NAN (Browse shelf(Opens below)) | Not for loan | 3155 |
Ch.1. Nanopackaging: nanotechnologies and electronics packaging -- Ch.2. Modelling technologies and applications -- Ch.3. Application of molecular dynamics simulation -- Ch.4. Advances in delamination modeling -- Ch.5. Nanoparticle properties -- Ch.6. Nanoparticle fabrication -- Ch.7. Nanoparticle-based high- k dieelectric composites: opportunities and challenges -- Ch.8. Nanostructured resistor materials -- Ch.9. Nanogranular magnetic core inductors: design, fabrication and packaging -- Ch.10. Nanoconductive adhesives -- Ch.11. Nanoparticles in microvias -- Ch.12. Materials and technology for conductive microstructures -- Ch.13. A study of nanoparticles in SnAg-based lead-free solders -- Ch.14. Nano-underfills for fine-pitch electronics -- Ch.15. Carbon nanotubes: synthesis and characterization -- Ch.16. Characteristics of carbon nanotubes for nanoelectronic device applications -- Ch.17. Carbon nanotubes for thermal management of microsystems -- Ch.18. Electromagnetic shielding of transceiver packaging using multiwall carbon nanotubes -- Ch.19. Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu solders reinforced with single-wall carbon nanotubes -- Ch.20. Nanowires in electronics packaging -- Ch.21. Design and development of stress-engineered compliant interconnect for microelectronic packaging -- Ch.22. Flip chip packaging for nanoscale silicon logic devices: challenges and opportunities -- Ch.23. Nanoelectronics landscape: application, technology and economy --
"Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement." "Nanopackaging: Nanotechnologies and Electronics Packaging is an important reference for industrial and academic researchers as well as practicing engineers seeking information about the latest techniques."--BOOK JACKET.
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