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Nanopackaging : nanotechnologies and electronics packaging / edited by James E. Morris

Contributor(s): Material type: TextTextPublication details: New York ; London : Springer, 2008.Description: xxi, 543 p. : ill. 25 cmISBN:
  • 9780387473253 (hbk.)
  • 0387473254 (hbk.)
Subject(s): DDC classification:
  • 621.381046 22 NAN
Contents:
Ch.1. Nanopackaging: nanotechnologies and electronics packaging -- Ch.2. Modelling technologies and applications -- Ch.3. Application of molecular dynamics simulation -- Ch.4. Advances in delamination modeling -- Ch.5. Nanoparticle properties -- Ch.6. Nanoparticle fabrication -- Ch.7. Nanoparticle-based high- k dieelectric composites: opportunities and challenges -- Ch.8. Nanostructured resistor materials -- Ch.9. Nanogranular magnetic core inductors: design, fabrication and packaging -- Ch.10. Nanoconductive adhesives -- Ch.11. Nanoparticles in microvias -- Ch.12. Materials and technology for conductive microstructures -- Ch.13. A study of nanoparticles in SnAg-based lead-free solders -- Ch.14. Nano-underfills for fine-pitch electronics -- Ch.15. Carbon nanotubes: synthesis and characterization -- Ch.16. Characteristics of carbon nanotubes for nanoelectronic device applications -- Ch.17. Carbon nanotubes for thermal management of microsystems -- Ch.18. Electromagnetic shielding of transceiver packaging using multiwall carbon nanotubes -- Ch.19. Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu solders reinforced with single-wall carbon nanotubes -- Ch.20. Nanowires in electronics packaging -- Ch.21. Design and development of stress-engineered compliant interconnect for microelectronic packaging -- Ch.22. Flip chip packaging for nanoscale silicon logic devices: challenges and opportunities -- Ch.23. Nanoelectronics landscape: application, technology and economy --
Review: "Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement." "Nanopackaging: Nanotechnologies and Electronics Packaging is an important reference for industrial and academic researchers as well as practicing engineers seeking information about the latest techniques."--BOOK JACKET.
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Holdings
Item type Current library Collection Call number Status Date due Barcode Item holds
Reference Reference Learning Resource Centre Reference Collection 621.381046 NAN (Browse shelf(Opens below)) Not for loan 3155
Total holds: 0

Ch.1. Nanopackaging: nanotechnologies and electronics packaging -- Ch.2. Modelling technologies and applications -- Ch.3. Application of molecular dynamics simulation -- Ch.4. Advances in delamination modeling -- Ch.5. Nanoparticle properties -- Ch.6. Nanoparticle fabrication -- Ch.7. Nanoparticle-based high- k dieelectric composites: opportunities and challenges -- Ch.8. Nanostructured resistor materials -- Ch.9. Nanogranular magnetic core inductors: design, fabrication and packaging -- Ch.10. Nanoconductive adhesives -- Ch.11. Nanoparticles in microvias -- Ch.12. Materials and technology for conductive microstructures -- Ch.13. A study of nanoparticles in SnAg-based lead-free solders -- Ch.14. Nano-underfills for fine-pitch electronics -- Ch.15. Carbon nanotubes: synthesis and characterization -- Ch.16. Characteristics of carbon nanotubes for nanoelectronic device applications -- Ch.17. Carbon nanotubes for thermal management of microsystems -- Ch.18. Electromagnetic shielding of transceiver packaging using multiwall carbon nanotubes -- Ch.19. Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu solders reinforced with single-wall carbon nanotubes -- Ch.20. Nanowires in electronics packaging -- Ch.21. Design and development of stress-engineered compliant interconnect for microelectronic packaging -- Ch.22. Flip chip packaging for nanoscale silicon logic devices: challenges and opportunities -- Ch.23. Nanoelectronics landscape: application, technology and economy --

"Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement." "Nanopackaging: Nanotechnologies and Electronics Packaging is an important reference for industrial and academic researchers as well as practicing engineers seeking information about the latest techniques."--BOOK JACKET.

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